DocumentCode
3339365
Title
System-on-chip or system-on-package: can we make an accurate decision on system implementation in an early design phase?
Author
Zheng, Li-Rong ; Shen, Meigen ; Tenhunen, Hannu
Author_Institution
Lab. of Electron. & Comput. Syst., R. Inst. of Technol. (KTH), Stockholm, Sweden
fYear
2003
fDate
23-25 Feb. 2003
Firstpage
1
Lastpage
4
Abstract
Single chip integration of analog/RF, memory, and logic means extra costs for noise isolation and for technology fusion. In some cases, system-on-package is preferred in terms of cost and performance. In this paper, we present a new design method and models for quantitative cost-performance trade-off analysis for mixed-signal integration. The method emphasizes a priori estimation, and hence is useful for accurately evaluating implementation issues at early system design phases. We show that depending on system complexity, integration scale, and mixed-signal performance requirements, single chip integration is riot necessary cheaper.
Keywords
VLSI; integrated circuit design; mixed analogue-digital integrated circuits; multichip modules; system-on-chip; SoC; SoP; cost-performance trade-off analysis; design method; early system design phases; estimation; implementation issues; mixed-signal integration; models; single chip integration; system-on-chip; system-on-package; CMOS technology; Costs; Digital circuits; Fabrication; Integrated circuit technology; Isolation technology; Logic circuits; Radio frequency; Random access memory; System-on-a-chip;
fLanguage
English
Publisher
ieee
Conference_Titel
Mixed-Signal Design, 2003. Southwest Symposium on
Print_ISBN
0-7803-7778-8
Type
conf
DOI
10.1109/SSMSD.2003.1190385
Filename
1190385
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