NANOPACK - Nano packaging technology for interconnect and heat dissipation

NANOPACK is a European large-scale integrating project aiming at the development of new technologies and materials for low thermal resistance interfaces and electrical interconnects, by exploring the capabilities offered by nanotechnologies such as carbon nanotubes, nanoparticles and nano-structured surfaces, and by using different enhancing contact formation mechanisms combined with high volume compatible manufacturing technologies. Several key research areas relative to thermal management, interconnect and packaging will be addressed by European industrial and academic partners: thermal interface materials, assembly, reliability and characterisation, supported by world class modeling and simulations. The benefits of the technologies will be evaluated in different applications to demonstrate improved performance of microprocessors, automotive and aerospace high power electronics and high power radio-frequency switches.