DocumentCode :
3339926
Title :
Large-signal characterization and modeling of a silicon bipolar technology for high-efficiency power applications up to C-band
Author :
Biondi, Tonio ; Carrara, Francesco ; Scuderi, Antonino ; Palmisano, Giuseppe
Author_Institution :
Facolta di Ingegneria, Catania Univ., Italy
fYear :
2003
fDate :
23-25 Feb. 2003
Firstpage :
138
Lastpage :
143
Abstract :
This paper presents the large-signal characterization and modeling of a 0.8-μm 46-GHz-fT silicon bipolar technology for RF power applications up to C-band. A set of devices with optimized layout and vertical structure was fabricated for on-wafer load-pull testing at 1.9 GHz, 2.4 GHz, and 5.2 GHz. Under continuous-wave operation, a 56% power-added efficiency and 11-dB large-signal gain were achieved at a 22-dBm output power level by an 80-μm emitter length device (180-μm2 emitter area) operating at 5.2 GHz with a 2.7-V supply voltage. A modified Gummel-Poon model was extracted from DC and multibias S-parameter measurements and validated by comparison with load-pull results. A close agreement was found between simulated and measured large-signal performance up to power levels well above the 1-dB compression point.
Keywords :
S-parameters; UHF integrated circuits; bipolar MMIC; integrated circuit layout; integrated circuit measurement; integrated circuit modelling; power integrated circuits; 0.8 micron; 1.9 to 5.2 GHz; 11 dB; 2.7 V; 46 GHz; 56 percent; 80 micron; C-band; RF power applications; S-parameter measurements; bipolar technology; continuous-wave operation; high-efficiency power applications; large-signal characterization; large-signal gain; modified Gummel-Poon model; on-wafer load-pull testing; optimized layout; power-added efficiency; vertical structure; Communication standards; Isolation technology; Power measurement; Radio frequency; Radiofrequency amplifiers; Silicon; Testing; Thermal conductivity; Time division multiple access; Wireless communication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Mixed-Signal Design, 2003. Southwest Symposium on
Print_ISBN :
0-7803-7778-8
Type :
conf
DOI :
10.1109/SSMSD.2003.1190413
Filename :
1190413
Link To Document :
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