Title :
STATPEP-current status of power electronic packaging for power supplies-methodology
Author :
Meinhardt, Mike ; Alderman, Arnold ; Flannery, John ; Cheasty, Philip ; Eckert, Sven ; Mathuna, Cian Ó
Author_Institution :
Nat. Microelectron. Res. Centre, Cork, Ireland
Abstract :
The paper shows the motivation, methodology and early results of a review of the status of power electronic packaging (STATPEP) used in commercial DC/DCand AC/DC-switch mode power supplies. Based on the current status and the knowledge about the development of PEP over the last 5 to 10 years experience curves are developed which show the expected trends in PEP of power supplies for the future. The STATPEP project is being co-sponsored by the PSMA and participating companies
Keywords :
AC-DC power convertors; DC-DC power convertors; power electronics; semiconductor device packaging; switched mode power supplies; AC/DC-switch mode power supplies; DC/DC-switch mode power supplies; PSMA; STATPEP; STATPEP project; experience curves; power electronic packaging; power supplies; Consumer electronics; Driver circuits; Electronics industry; Electronics packaging; Manufacturing; Power electronics; Power supplies; Power systems; Switches; Voltage;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 1999. APEC '99. Fourteenth Annual
Conference_Location :
Dallas, TX
Print_ISBN :
0-7803-5160-6
DOI :
10.1109/APEC.1999.749484
