Preparation and dielectric behavior of epoxy resin containing graphene oxide

Author

Mancinelli, P. ; Fabiani, Davide ; Saccani, A. ; Toselli, M. ; Heid, T. ; Frechette, Michel ; Savoie, S. ; David, E.

Author_Institution

DEI, Univ. of Bologna, Bologna, Italy

fYear

2013

fDate

June 30 2013-July 4 2013

Firstpage

915

Lastpage

918

Abstract

Graphene oxide (GO) and chemically modified graphene oxide have been dispersed in low amount (until 0.5 wt%) into epoxy resin. Comparing the dielectric responses of the polymer nanocomposites with those of neat epoxy, no significantly changes were noted. Relevant differences were recorded after a post-curing heating treatment able to reduce the dispersed GO to more conductive graphene. Neat epoxy and epoxy samples with chemically modified GO had usually a small decrease on permittivity while GO samples showed an increase of about 10% of the value previously observed. This behavior will be connected with chemical properties of the nanofiller.

Keywords

curing; filled polymers; graphene; heat treatment; materials preparation; nanocomposites; nanofabrication; permittivity; resins; CO; chemically modified graphene oxide; conductive graphene; dielectric properties; epoxy resin; neat epoxy; permittivity; polymer nanocomposites; postcuring heating; Chemicals; Dielectrics; Dispersion; Graphene; Nanocomposites; Permittivity; Polymers; graphene; graphene oxide reduction; nanodielectric; naocomposites; permittvity change;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid Dielectrics (ICSD), 2013 IEEE International Conference on

Conference_Location

Bologna

ISSN

2159-1687

Print_ISBN

978-1-4799-0807-3

Type

conf

DOI

10.1109/ICSD.2013.6619697

Filename

6619697