DocumentCode
3340632
Title
Spacing impact on MOSFET mismatch
Author
Cathignol, A. ; Mennillo, S. ; Bordez, S. ; Vendrame, L. ; Ghibaudo, G.
Author_Institution
STMicroelectronics, Crolles
fYear
2008
fDate
24-27 March 2008
Firstpage
90
Lastpage
95
Abstract
Many test structures embedded in various technologies were measured to study the spacing impact on MOSFET mismatch. This impact is showed to highly depend on technology, device family, device type and bias conditions. The study of spatial correlation allows to properly model spacing impact on mismatch: this analysis -in this paper focused on MOSFETs- may be extended to any device. Finally, a worst case model that only requires standard matched pairs at minimum spacing is proposed to provide designers the maximum matching degradation that may affect spaced devices.
Keywords
MOSFET; MOSFET mismatch; maximum matching degradation; spacing impact; spatial correlation; MOSFET circuits; Microelectronics; Testing; correlation; fluctuations; matching; mismatch; spacing; variability;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures, 2008. ICMTS 2008. IEEE International Conference on
Conference_Location
Edinburgh
Print_ISBN
978-1-4244-1800-8
Electronic_ISBN
978-1-4244-1801-5
Type
conf
DOI
10.1109/ICMTS.2008.4509320
Filename
4509320
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