Advances in high throughput wafer and solar cell technology for EFG ribbon

Author

Kalejs, J. ; Mackintosh, B. ; Schmidt, Werner ; Woesten, B.

Author_Institution

ASE Americas Inc., Billerica, MA, USA

fYear

2002

fDate

19-24 May 2002

Firstpage

74

Lastpage

77

Abstract

Construction of as many as 70 × 100 MW manufacturing facilities in the next two decades is required to address U.S. Photovoltaic Industry Roadmap targets. Effective material utilization, high throughput and yield, improvements in solar cell efficiency, and minimizing the environmental impact of manufacturing waste products are all desirable attributes that must be combined in low cost factory equipment. We discuss how these elements are being addressed with ribbon technology now under development for crystalline silicon wafer production by the Edge-defined Film-fed Growth (EFG) method.

Keywords

crystal growth from melt; elemental semiconductors; semiconductor device manufacture; semiconductor growth; silicon; solar cells; 100 MW; EFG ribbon; Si; edge-defined film-fed growth method; effective material utilization; environmental impact; high throughput wafer technology; low cost factory equipment; manufacturing waste products; solar cell efficiency; solar cell technology; Construction industry; Costs; Crystalline materials; Manufacturing industries; Photovoltaic cells; Photovoltaic systems; Production facilities; Solar power generation; Throughput; Waste materials;

fLanguage

English

Publisher

ieee

Conference_Titel

Photovoltaic Specialists Conference, 2002. Conference Record of the Twenty-Ninth IEEE

ISSN

1060-8371

Print_ISBN

0-7803-7471-1

Type

conf

DOI

10.1109/PVSC.2002.1190459

Filename

1190459