• DocumentCode
    3340899
  • Title

    Advanced test structure design for dielectric characterisation of novel high-k materials

  • Author

    Sullivan, John A O ; Chen, Wenbin ; McCarthy, Kevin G. ; Crean, G.M.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Univ. Coll. Cork, Cork
  • fYear
    2008
  • fDate
    24-27 March 2008
  • Firstpage
    180
  • Lastpage
    184
  • Abstract
    The extremely high level of integration currently required within the wireless industry poses significant challenges at all technology steps from materials through processing to packaging. Capacitor design is a very important element of this technology integration challenge. Recently there has been strong interest in the use of PMNT (Pb(Mg,Nb)TiO3) as a thin-film layer in semiconductor processes [1]. The high dielectric constant of PMNT makes it an attractive material for the fabrication of MIM (Metal/Insulator/Metal) decoupling capacitors. Before PMNT can be used in conjunction with a modern Si process for capacitor design the PMNT layer must be accurately characterised. This paper addresses the issue of thin- film characterisation through wafer-probe measurements and electromagnetic simulation (EM) of coplanar waveguides. Based on the results obtained a design methodology for optimum test structure layout is presented.
  • Keywords
    coplanar waveguides; dielectric materials; testing; thin film devices; Si; coplanar waveguide; dielectric characterisation; dielectric constant; electromagnetic simulation; high-K material; optimum test structure layout; semiconductor process; test structure design; thin film characterisation; thin film layer; wafer probe measurement; Dielectric materials; Dielectric thin films; Electromagnetic waveguides; High K dielectric materials; High-K gate dielectrics; MIM capacitors; Materials testing; Metal-insulator structures; Semiconductor device packaging; Semiconductor materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures, 2008. ICMTS 2008. IEEE International Conference on
  • Conference_Location
    Edinburgh
  • Print_ISBN
    978-1-4244-1800-8
  • Electronic_ISBN
    978-1-4244-1801-5
  • Type

    conf

  • DOI
    10.1109/ICMTS.2008.4509335
  • Filename
    4509335