DocumentCode :
3340899
Title :
Advanced test structure design for dielectric characterisation of novel high-k materials
Author :
Sullivan, John A O ; Chen, Wenbin ; McCarthy, Kevin G. ; Crean, G.M.
Author_Institution :
Dept. of Electr. & Electron. Eng., Univ. Coll. Cork, Cork
fYear :
2008
fDate :
24-27 March 2008
Firstpage :
180
Lastpage :
184
Abstract :
The extremely high level of integration currently required within the wireless industry poses significant challenges at all technology steps from materials through processing to packaging. Capacitor design is a very important element of this technology integration challenge. Recently there has been strong interest in the use of PMNT (Pb(Mg,Nb)TiO3) as a thin-film layer in semiconductor processes [1]. The high dielectric constant of PMNT makes it an attractive material for the fabrication of MIM (Metal/Insulator/Metal) decoupling capacitors. Before PMNT can be used in conjunction with a modern Si process for capacitor design the PMNT layer must be accurately characterised. This paper addresses the issue of thin- film characterisation through wafer-probe measurements and electromagnetic simulation (EM) of coplanar waveguides. Based on the results obtained a design methodology for optimum test structure layout is presented.
Keywords :
coplanar waveguides; dielectric materials; testing; thin film devices; Si; coplanar waveguide; dielectric characterisation; dielectric constant; electromagnetic simulation; high-K material; optimum test structure layout; semiconductor process; test structure design; thin film characterisation; thin film layer; wafer probe measurement; Dielectric materials; Dielectric thin films; Electromagnetic waveguides; High K dielectric materials; High-K gate dielectrics; MIM capacitors; Materials testing; Metal-insulator structures; Semiconductor device packaging; Semiconductor materials;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Test Structures, 2008. ICMTS 2008. IEEE International Conference on
Conference_Location :
Edinburgh
Print_ISBN :
978-1-4244-1800-8
Electronic_ISBN :
978-1-4244-1801-5
Type :
conf
DOI :
10.1109/ICMTS.2008.4509335
Filename :
4509335
Link To Document :
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