DocumentCode
3340899
Title
Advanced test structure design for dielectric characterisation of novel high-k materials
Author
Sullivan, John A O ; Chen, Wenbin ; McCarthy, Kevin G. ; Crean, G.M.
Author_Institution
Dept. of Electr. & Electron. Eng., Univ. Coll. Cork, Cork
fYear
2008
fDate
24-27 March 2008
Firstpage
180
Lastpage
184
Abstract
The extremely high level of integration currently required within the wireless industry poses significant challenges at all technology steps from materials through processing to packaging. Capacitor design is a very important element of this technology integration challenge. Recently there has been strong interest in the use of PMNT (Pb(Mg,Nb)TiO3) as a thin-film layer in semiconductor processes [1]. The high dielectric constant of PMNT makes it an attractive material for the fabrication of MIM (Metal/Insulator/Metal) decoupling capacitors. Before PMNT can be used in conjunction with a modern Si process for capacitor design the PMNT layer must be accurately characterised. This paper addresses the issue of thin- film characterisation through wafer-probe measurements and electromagnetic simulation (EM) of coplanar waveguides. Based on the results obtained a design methodology for optimum test structure layout is presented.
Keywords
coplanar waveguides; dielectric materials; testing; thin film devices; Si; coplanar waveguide; dielectric characterisation; dielectric constant; electromagnetic simulation; high-K material; optimum test structure layout; semiconductor process; test structure design; thin film characterisation; thin film layer; wafer probe measurement; Dielectric materials; Dielectric thin films; Electromagnetic waveguides; High K dielectric materials; High-K gate dielectrics; MIM capacitors; Materials testing; Metal-insulator structures; Semiconductor device packaging; Semiconductor materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures, 2008. ICMTS 2008. IEEE International Conference on
Conference_Location
Edinburgh
Print_ISBN
978-1-4244-1800-8
Electronic_ISBN
978-1-4244-1801-5
Type
conf
DOI
10.1109/ICMTS.2008.4509335
Filename
4509335
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