DocumentCode :
3340978
Title :
Effects of load cycles on AC extruded cable reliability: Is a reduced pre-qualification test always the right choice?
Author :
Mazzanti, G. ; Marzinotto, M.
Author_Institution :
Electr. Eng. Dept., Univ. of Bologna, Bologna, Italy
fYear :
2013
fDate :
June 30 2013-July 4 2013
Firstpage :
648
Lastpage :
651
Abstract :
In this paper, a new method is proposed for the estimation of time to failure percentiles and life fraction lost in the so-called “Extension of pre-Qualification (EQ) test” according to CIGRE TBs 303. The method accounts for the time-varying temperature during the EQ load cycles via an approach that relies on: 1) Miner´s law of cumulated aging; 2) an improved voltage-time characteristic that includes the electro-thermal stress; 3) a probabilistic framework based on the Weibull hypothesis. On these grounds, an alternative to the EQ test is proposed, referred to as “Improved Extension of Qualification (IEQ) test”, based on a more strict correlation between cable insulation reliability in design stress conditions and that during the test itself, thereby taking into account the electro-thermal endurance features of a given extruded cable design.
Keywords :
power cable insulation; power cable testing; probability; reliability; AC extruded cable reliability; CIGRE TBs 303; EQ load cycle effect; IEQ test; Miner law; Weibull hypothesis; cable insulation reliability; cumulated aging; design stress conditions; electro-thermal endurance features; electro-thermal stress; extension of pre-qualification test; extruded cable design; improved extension of qualification test; improved voltage-time characteristic; life fraction lost; probabilistic framework; reduced pre-qualification test; time to failure percentile estimation; time-varying temperature; Aging; Cable insulation; Conductors; IEC standards; Power cables; Stress; Thermal stresses; electro-thermal stress; extension of prequalification; extruded cables; qualification tests;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid Dielectrics (ICSD), 2013 IEEE International Conference on
Conference_Location :
Bologna
ISSN :
2159-1687
Print_ISBN :
978-1-4799-0807-3
Type :
conf
DOI :
10.1109/ICSD.2013.6619723
Filename :
6619723
Link To Document :
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