Title :
A comparison of wafers sawn by resin bonded and electroplated diamond wire — From wafer to cell
Author :
Pin-Hsueh Tsai ; Yen-Chun Chou ; Shang-Wei Yang ; Yu-Chung Chen ; Chih-Hsyong Wu
Author_Institution :
Motech Ind., Inc., Tainan, Taiwan
Abstract :
In this work we investigated the wafer quality from wafer process to cell process. These wafers were sawn by two types of diamond wire. The difference between the two types of diamond wires is the bonding layer - resin bonded and electroplated. To investigate the wafers´ quality, few wafers are taken to test the breakage strength with bending test. We observed the wafer morphology with SEM. The subsurface damage was observed with TEM and Raman spectroscopy. At last wafers were made to cells for electrical performance verification.
Keywords :
diamond; electroplating; resins; scanning electron microscopy; transmission electron microscopy; wafer bonding; Raman spectroscopy; SEM; TEM; bending test; bonding layer; breakage strength; electrical performance verification; electroplated diamond wire; resin bonding; wafer morphology; wafer process; wafer quality; Bonding; Diamonds; Resins; Sawing; Scanning electron microscopy; Slurries; Wires; Materials processing; Photovoltaic cells; Product development; Research and development; Silicon;
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2013 IEEE 39th
Conference_Location :
Tampa, FL
DOI :
10.1109/PVSC.2013.6744204
