DocumentCode
3341050
Title
[Front cover]
fYear
2008
fDate
16-20 March 2008
Abstract
The following topics are dealt with: PC board thermal management; high power LED performance; electro-thermal simulators; logi-thermal simulators; temperature-aware design of complex IC; package level cooling; on-die cooling; dual-core CPU; embedded thermoelectric devices; integrated module board thermal characteristics; high performance thermal interface materials; parametric thermal analysis; system level cooling; DC-DC power modules thermal performance; electronics product environment; radiation heat transfer; plate-fin heat sinks; one-sided actuating piezoelectric micropump; spraycool command post platform; liquid cooling; data center cooling; single-phase self-oscillating jets cooling; thermal test vehicle; radially oscillating flow hybrid cooling system; sub-cooled pumped liquid system; fluoroketone heat transfer fluid; thin film isotropic thermal conductivity measurement; thin film anisotropic thermal conductivity measurement; thermoreflectance imaging; junction-to-case thermal resistance; silicon microchannel heat sinks; IGBT drive system cooling; vaporizable dielectric fluid; nanofluid effect; VLSI ICs temperature profiles; and turbulent flows in electronics.
Keywords
VLSI; cooling; heat sinks; heat transfer; insulated gate bipolar transistors; integrated circuit design; integrated circuit testing; microchannel flow; micropumps; piezoelectric devices; power semiconductor devices; printed circuits; silicon; thermal analysis; thermal conductivity measurement; thermal management (packaging); thermoelectric devices; thermoreflectance; turbulence; DC-DC power modules thermal performance; IGBT drive system cooling; PC board thermal management; Si; VLSI ICs temperature profiles; data center cooling; dual-core CPU; electro-thermal simulators; electronics product environment; embedded thermoelectric devices; fluoroketone heat transfer fluid; high performance thermal interface materials; high power LED performance; integrated module board thermal characteristics; liquid cooling; logi-thermal simulators; nanofluid effect; on-die cooling; one-sided actuating piezoelectric micropump; package level cooling; parametric thermal analysis; plate-fin heat sinks; radially oscillating flow hybrid cooling system; radiation heat transfer; silicon microchannel heat sinks; single-phase self-oscillating jets cooling; spraycool command post platform; sub-cooled pumped liquid system; system level cooling; temperature-aware design of complex IC; thermal test vehicle; thermoreflectance imaging; thin film anisotropic thermal conductivity measurement; thin film isotropic thermal conductivity measurement; two phase cooling; vaporizable dielectric fluid;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE
Conference_Location
San Jose, CA
ISSN
1065-2221
Print_ISBN
978-1-4244-2123-7
Type
conf
DOI
10.1109/STHERM.2008.4509348
Filename
4509348
Link To Document