Title :
High-rate (> 1 nm/s) plasma deposited a-SiNx:H films for mc-Si solar cell application
Author :
Hong, J. ; Kessels, W.M.M. ; van Assche, F.J.H. ; Bik, W.M.Arnold ; Rieffe, H.C. ; Soppe, W.J. ; Weeber, A.W. ; van de Sanden, M.C.M.
Author_Institution :
Dept. of Appl. Phys., Eindhoven Univ. of Technol., Netherlands
Abstract :
We present hydrogenated amorphous silicon nitride (a-SiNx:H) films for multicrystalline silicon (mc-Si) solar cells that are deposited at high rate (> 1nm/s) using an expanding thermal plasma. This remote plasma technique permits one to deposit a-SiNx:H with good antireflection coating properties and induces bulk passivation in mc-Si solar cells. The latter was observed by an enhanced red response of the cells´ internal quantum efficiency. Here, we focus on the complete characterization of a-SiNx:H films deposited under various conditions from N2/SiH4 and NH3/SiH4 mixtures. The film properties of a-SiNx:H are found to be determined mainly by the N/Si ratio ranging from Si-rich to near-stoichiometric N-rich films. A study of hydrogen evolution after a thermal anneal by a firing-through process shows two distinctive regimes in terms of the N/Si ratio and the mass density of the a-SiNx:H films.
Keywords :
annealing; antireflection coatings; elemental semiconductors; hydrogen; passivation; plasma CVD coatings; semiconductor-insulator boundaries; silicon; silicon compounds; solar cells; stoichiometry; N2/SiH4 mixture; NH3/SiH4 mixture; SiNx:H-Si; bulk passivation; enhanced red response; expanding thermal plasma; good antireflection coating properties; high-rate plasma deposited a-SiNx:H films; hydrogenated amorphous silicon nitride films; internal quantum efficiency; mc-Si solar cell application; multicrystalline silicon; remote plasma technique; Amorphous silicon; Optical films; Passivation; Photovoltaic cells; Physics; Plasma applications; Plasma properties; Plasma sources; Production; Semiconductor films;
Conference_Titel :
Photovoltaic Specialists Conference, 2002. Conference Record of the Twenty-Ninth IEEE
Print_ISBN :
0-7803-7471-1
DOI :
10.1109/PVSC.2002.1190479