• DocumentCode
    3341123
  • Title

    Experimental study on the electrical and thermal properties of epoxy-crepe paper composites for use in UHV DC bushing condensers

  • Author

    Shiling Zhang ; Zongren Peng ; Liu Peng ; Xin Ning

  • Author_Institution
    State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
  • fYear
    2013
  • fDate
    June 30 2013-July 4 2013
  • Firstpage
    405
  • Lastpage
    408
  • Abstract
    Entire performance of UHVDC resin impregnated paper (RIP) bushings in operation condition has an intimate connection with electrical and thermal properties of epoxy/crepe paper composites used in bushing condenser. Firstly, some samples of pure epoxy and epoxy/crepe composites which are identical to those used in actual RIP bushings were fabricated. Then micro morphology of these samples has been observed by scanning electron microscopy (SEM) and polarized light microscopy (PLM). Some electrical performance measurements were carried out including AC breakdown characteristics, bulk resistivity versus temperature characteristics and dielectric spectroscopy with broadband dielectric spectra. Meanwhile, thermal property containing thermal conductivity versus temperature characteristic has also been obtained experimentally. Finally, with these parameters of composites, electric field and temperature distribution inside bushing condenser has also been simulated by finite element method (FEM).
  • Keywords
    HVDC power transmission; bushings; epoxy insulation; finite element analysis; impregnated insulation; optical microscopy; scanning electron microscopy; temperature distribution; thermal conductivity; AC breakdown; PLM; SEM; UHVDC bushing condensers; UHVDC resin impregnated paper bushings; broadband dielectric spectra; bulk resistivity; dielectric spectroscopy; epoxy-crepe paper composites; finite element method; polarized light microscopy; scanning electron microscopy; temperature distribution; thermal conductivity; Conductivity; Dielectrics; Electric breakdown; Insulators; Temperature distribution; Temperature measurement; Thermal conductivity; UHVDC RIP bushings; electric and temperature distribution; electrical and thermal properties; epoxy/crepe paper composites;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics (ICSD), 2013 IEEE International Conference on
  • Conference_Location
    Bologna
  • ISSN
    2159-1687
  • Print_ISBN
    978-1-4799-0807-3
  • Type

    conf

  • DOI
    10.1109/ICSD.2013.6619730
  • Filename
    6619730