Effect of Nanofluid on Flat Heat Pipe Thermal Performance

Author

Yu Tang Chen ; Wei Chiang Wei ; Shung Wen Kang ; Chun Sheng

Author_Institution

Dept. of Mech. Eng., De Lin Inst. of Technol., Taipei

fYear

2008

fDate

16-20 March 2008

Firstpage

16

Lastpage

19

Abstract

This study utilizes a silver nano-fluid on a flat heat pipe. It studies the effect of various concentrations on flat heat pipe thermal performance by air-cooling testing equipment. The particles used in these experiments were silver particles 35 nm in size. The base working fluid was pure-water. Nano- fluids were prepared using a two-step method. In the experiment, the thickness and length of the heat pipe are 3 mm and 200 cm, respectively. An experimental system was set up to measure the temperature distribution of heat pipes and calculate the thermal resistance by equation R = DeltaT IQ. At the same charge volume, the thermal resistance of the heat pipe filled with nano-fluid was lower than that of DI water.

Keywords

cooling; heat pipes; liquid metals; nanoelectronics; silver; thermal resistance; Ag; air-cooling testing; flat heat pipes; pipe temperature distribution; silver nano-fluids; size 200 cm; size 3 mm; size 35 mm; thermal performance; two-step method; Charge measurement; Current measurement; Electrical resistance measurement; Resistance heating; Silver; Temperature measurement; Testing; Thermal resistance; Volume measurement; Water heating; Nano-fluid; flat heat pipe;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE

Conference_Location

San Jose, CA

ISSN

1065-2221

Print_ISBN

978-1-4244-2123-7

Type

conf

DOI

10.1109/STHERM.2008.4509359

Filename

4509359