Strategies for Modeling Turbulent Flows in Electronics

Author

Tyacke, J. ; Tucker, Paul ; Nithiarasu, P.

Author_Institution

Civil & Comput. Eng. Centre, Swansea Univ., Swansea

fYear

2008

fDate

16-20 March 2008

Firstpage

39

Lastpage

45

Abstract

Hybrid methods based on the Reynolds Averaged Navier Stokes (RANS) equations and the Large Eddy Simulation (LES) formulation are investigated to try and improve the accuracy of heat transfer and surface temperature predictions for electronics systems and components. Two relatively low Reynolds number flows are studied using hybrid RANS-LES, RANS-Implicit-LES (RANS-ILES) and non-linear LES models. Predictions using these methods are in good agreement with each other, even using different grid resolutions.

Keywords

Navier-Stokes equations; electronics industry; flow simulation; heat transfer; turbulence; Reynolds averaged Navier Stokes equations; electronics systems; heat transfer; large eddy simulation; surface temperature predictions; turbulent flows; Aerospace industry; Computational fluid dynamics; Equations; Grid computing; Heat transfer; Predictive models; Radio access networks; Solid modeling; Thermal stresses; Viscosity; DES; Heat transfer; LES; RANS; surface temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE

Conference_Location

San Jose, CA

ISSN

1065-2221

Print_ISBN

978-1-4244-2123-7

Electronic_ISBN

1065-2221

Type

conf

DOI

10.1109/STHERM.2008.4509363

Filename

4509363