Title :
Dielectric properties and thermal conductivity of epoxy/AlN composites with several kinds of filler-matrix interfaces
Author :
Tanaka, T. ; Iizuka, Tetsuya ; Ohki, Y. ; Huang, Xumin ; Jiang, Pingping
Author_Institution :
IPS Res. Center, Waseda Univ., Kitakyushu, Japan
fDate :
June 30 2013-July 4 2013
Abstract :
Epoxy/AlN composites were prepared using high purity AlN particles with an average size of 1.1 μm. AlN particles were surface-treated with three kinds of silane coupling agents and three kinds of surface-modifiers. Dielectric properties and thermal conductivity were evaluated. As a result, it was found that silane coupling agents with epoxy, mercapto, and amino groups create higher thermal conductivity than surface modifiers such as GO, POSS and hyper-branched polymer. A silane coupling agent with mercapto group and a graphene oxide surface modifier are promising at high and low loading levels, respectively. From the dielectric spectroscopy study, it can be said that interfacial conditions should be improved by finding out proper methods.
Keywords :
aluminium compounds; filled polymers; particle size; permittivity; resins; surface treatment; thermal conductivity; AlN; amino groups; average particle size; dielectric properties; dielectric spectroscopy; epoxy-AlN composites; filler-matrix interfaces; graphene oxide surface modifier; high purity particles; mercapto group; silane coupling agents; size 1.1 mum; surface-treatment; thermal conductivity; Conductivity; Dielectrics; III-V semiconductor materials; Loading; Permittivity; Polymers; Thermal conductivity; coupling agents; high thermal conductivity; interfaces; multifunctional materials; polymer composites;
Conference_Titel :
Solid Dielectrics (ICSD), 2013 IEEE International Conference on
Conference_Location :
Bologna
Print_ISBN :
978-1-4799-0807-3
DOI :
10.1109/ICSD.2013.6619742
