• DocumentCode
    3341561
  • Title

    Shaping the nanostructures from electromigration-based deposition

  • Author

    Fan, Zheng ; Tao, Xinyong ; Cui, Xudong ; Fan, Xudong ; Zhang, Xiaobin ; Dong, Lixin

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
  • fYear
    2010
  • fDate
    12-15 Oct. 2010
  • Firstpage
    22
  • Lastpage
    25
  • Abstract
    Electromigration-based deposition (EMBD) is proposed for the fabrication of three-dimensional (3D) metallic nanostructures. The process is based on nanofluidic mass delivery at the attogram scale from metal-filled carbon nanotubes (m@CNTs) using nanorobotic manipulation inside a transmission electron microscope. By attaching a conductive probe to the sidewall of the CNT, it has been shown that mass flow can be achieved regardless the conductivity of the object surface. Experiments have also shown the influence of heat sinks on the geometries of the deposits from EMBD. By modulating the relative position between the deposit and the heat sinks, it becomes possible to reshape the deposits. As a general-purposed nanofabrication process, EMBD will enable a variety of applications such as nanorobotic arc welding and assembly, nanoelectrodes direct writing, and nanoscale metallurgy.
  • Keywords
    carbon nanotubes; electromigration; heat sinks; manipulators; nanofabrication; nanolithography; transmission electron microscopy; 3D metallic nanostructures; C; EMBD; electromigration-based deposition; general-purposed nanofabrication process; heat sinks; mCNT; mass flow; metal-filled carbon nanotubes; nanoelectrode direct writing; nanofluidic mass delivery; nanolithography technology; nanorobotic arc welding; nanorobotic manipulation; nanoscale metallurgy; nanostructure shaping; three-dimensional metallic nanostructure fabrication; transmission electron microscope; Copper; Heat sinks; Nanostructures; Probes; Shape; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    978-1-4244-8896-4
  • Type

    conf

  • DOI
    10.1109/NMDC.2010.5651936
  • Filename
    5651936