Title :
Testing and Specifying Thermal Performance of DC-DC Power Modules used in Sealed Box Applications
Author :
Wojtasik, Andrzej
Author_Institution :
Ericsson Power Modules, Stockholm
Abstract :
Output power derating vs. ambient temperature and airflow is a widely used method for defining the thermal limitations of dc-dc power modules. However, this method is not suitable for sealed box applications where the modules are mainly conduction cooled by means of an external heatsink often referred to as a "cold wall" or "cold plate". In this paper a new method for testing and presentation of results for dc-dc modules in such applications is proposed.
Keywords :
DC-DC power convertors; modules; seals (stoppers); thermal management (packaging); DC-DC power modules; cold wall cooling; sealed box applications; thermal performance; Aluminum; Cold plates; Communications technology; Cooling; Multichip modules; Power generation; Radio frequency; Temperature; Testing; Thermal resistance; Thermal derating; cold wall cooling; dc-dc power modules;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2123-7
Electronic_ISBN :
1065-2221
DOI :
10.1109/STHERM.2008.4509374
