DocumentCode
3341595
Title
Creation of a Thermal Technology Roadmap in a Consumer Electronics Product Environment
Author
Martin, Genevieve ; Eggink, Erik
Author_Institution
Philips Appl. Technol., Eindhoven
fYear
2008
fDate
16-20 March 2008
Firstpage
106
Lastpage
111
Abstract
Thermal issues and problems of a product are emerging very early in the Product Creation Process (PCP). Innovation, Time to market and Cost are three important drivers of the consumer electronics market. While costs of changes exponentially increase during the product development cycle, the freedom to implement changes substantially diminishes. It is therefore important to identify very early in the PCP the thermal risks and associate to them possible cooling technologies or strategies. A Thermal Technology Roadmap (TTR) can lead to better strategic choices; it is a decision tool for long term investments in pre-development, it enables getting a common long term vision within the organization and it enables synergy between research centers and product development teams. This publication describes a methodology developed to create a Thermal Technology Roadmap (TTR) associating a product roadmap to emerging technologies. The resulting TTR identifies the most promising cooling technologies for the product range on short, middle and long terms according to defined criteria.
Keywords
consumer electronics; thermal management (packaging); consumer electronics product environment; thermal technology roadmap; Consumer electronics; Costs; Electronic packaging thermal management; Electronics cooling; Product development; Semiconductor device packaging; Technological innovation; Technology management; Thermal management; Thermal management of electronics; Consumer electronics; Emerging cooling technologies; Product architecture; Product range; Product roadmap; System level; Thermal Technology Roadmap;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE
Conference_Location
San Jose, CA
ISSN
1065-2221
Print_ISBN
978-1-4244-2123-7
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/STHERM.2008.4509375
Filename
4509375
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