• DocumentCode
    3341595
  • Title

    Creation of a Thermal Technology Roadmap in a Consumer Electronics Product Environment

  • Author

    Martin, Genevieve ; Eggink, Erik

  • Author_Institution
    Philips Appl. Technol., Eindhoven
  • fYear
    2008
  • fDate
    16-20 March 2008
  • Firstpage
    106
  • Lastpage
    111
  • Abstract
    Thermal issues and problems of a product are emerging very early in the Product Creation Process (PCP). Innovation, Time to market and Cost are three important drivers of the consumer electronics market. While costs of changes exponentially increase during the product development cycle, the freedom to implement changes substantially diminishes. It is therefore important to identify very early in the PCP the thermal risks and associate to them possible cooling technologies or strategies. A Thermal Technology Roadmap (TTR) can lead to better strategic choices; it is a decision tool for long term investments in pre-development, it enables getting a common long term vision within the organization and it enables synergy between research centers and product development teams. This publication describes a methodology developed to create a Thermal Technology Roadmap (TTR) associating a product roadmap to emerging technologies. The resulting TTR identifies the most promising cooling technologies for the product range on short, middle and long terms according to defined criteria.
  • Keywords
    consumer electronics; thermal management (packaging); consumer electronics product environment; thermal technology roadmap; Consumer electronics; Costs; Electronic packaging thermal management; Electronics cooling; Product development; Semiconductor device packaging; Technological innovation; Technology management; Thermal management; Thermal management of electronics; Consumer electronics; Emerging cooling technologies; Product architecture; Product range; Product roadmap; System level; Thermal Technology Roadmap;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4244-2123-7
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/STHERM.2008.4509375
  • Filename
    4509375