• DocumentCode
    3341749
  • Title

    Properties of a new ecofficient coating for magnet wire

  • Author

    Ait-Amar, S. ; Ben Fatallah, M. ; Habas, A. ; Habas, J.-P. ; Notingher, Petru ; Frezel, P.

  • Author_Institution
    Univ. Lille Nord de France, Lille, France
  • fYear
    2013
  • fDate
    June 30 2013-July 4 2013
  • Firstpage
    553
  • Lastpage
    556
  • Abstract
    Classical magnet wires used for manufacturing electrical machine and transformer windings are made with polluting processes involving carcinogen solvents and CO2 emissions. Their production also requires significant electric energy. An innovative varnish produced with a more ecological process, without any solvent and no CO2 or NOx emission, has been proposed. The insulation of this copper wire is composed of an UV-polymerized polyester acrylate layer covered by an extruded thermostable resin (polyphenylene sulfide). The present work aims to explore the properties of this new ecofficient coating for magnet wire application. Calorimetric, thermogravimetric and dielectric analyses were performed to study the new coating. Accelerated tests were conducted to highlight the structural and dielectric changes occurring during thermal ageing.
  • Keywords
    ageing; air pollution; calorimetry; coatings; dielectric materials; electric machines; magnetic devices; resins; thermal analysis; transformer windings; varnish; wires; NOx emission; UV-polymerized polyester acrylate layer; accelerated tests; calorimetry; carbon dioxide emissions; carcinogen solvents; dielectric analyses; dielectric changes; ecofficient coating; ecological process; electric energy; electrical machine manufacturing; magnet wire; polluting processes; thermal ageing; thermogravimetry; thermostable resin; transformer winding; Capacitance; Dielectrics; Insulation; Partial discharges; Temperature; Temperature measurement; Wires; eco-friendly dielectric; free-solvent; magnet wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics (ICSD), 2013 IEEE International Conference on
  • Conference_Location
    Bologna
  • ISSN
    2159-1687
  • Print_ISBN
    978-1-4799-0807-3
  • Type

    conf

  • DOI
    10.1109/ICSD.2013.6619761
  • Filename
    6619761