DocumentCode :
334197
Title :
LIGA fabrication of mm-wave accelerating cavity structures at the Advanced Photon Source (APS)
Author :
Song, J.J. ; Bajikar, S. ; Kang, Y.W. ; Kustom, R.L. ; Mancini, D.C. ; Nassiri, A. ; Lai, B. ; Feinerman, A.D. ; White, V.
Author_Institution :
Argonne Nat. Lab., IL, USA
Volume :
1
fYear :
1997
fDate :
12-16 May 1997
Firstpage :
461
Abstract :
Recent microfabrication technologies based on the LIGA (German acronym for Lithographe, Galvanoformung, und Abformung) process have been applied to build high-aspect-ratio, metallic or dielectric planar structures suitable for high-frequency rf cavity structures. The cavity structures would be used as parts of linear accelerators, microwave undulators, and mm-wave amplifiers. The microfabrication process includes manufacture of precision X-ray masks, exposure of positive resist by X-rays through the mask, resist development, and electroforming of the final microstructure. Prototypes of a 32-cell, 108-GHz constant-impedance cavity and a 66-cell, 94-GHz constant-gradient cavity were fabricated with the synchrotron radiation sources at APS and NSLS. This paper presents an overview of the new technology and details of the mm-wave cavity fabrication
Keywords :
LIGA; accelerator RF systems; accelerator cavities; APS; Advanced Photon Source; LIGA; LIGA fabrication; constant-gradient cavity; constant-impedance cavity; dielectric planar structures; linear accelerators; metallic planar structures; microfabrication technologies; microwave undulators; mm-wave accelerating cavity structures; mm-wave amplifiers; synchrotron radiation sources; Acceleration; Dielectrics; Fabrication; Linear accelerators; Manufacturing processes; Microstructure; Microwave amplifiers; Radiofrequency amplifiers; Resists; Undulators;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Particle Accelerator Conference, 1997. Proceedings of the 1997
Conference_Location :
Vancouver, BC
Print_ISBN :
0-7803-4376-X
Type :
conf
DOI :
10.1109/PAC.1997.749687
Filename :
749687
Link To Document :
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