• DocumentCode
    3342904
  • Title

    Embedded Powerline Communication in Large Scale Distribution Automation and Demand Side Management System

  • Author

    Lu, Liping ; Zhou, Jianhua ; Hu, Jian ; Li, Gangyan ; Song, Yeqiong

  • Author_Institution
    Sch. of Mech. & Electron. Eng., Wuhan Univ. of Technol.
  • fYear
    2006
  • fDate
    Aug. 2006
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Implementation of distribution automation (DA) and demand side management (DSM) intended to serve both utilities and a large number of customers which spread over a large geographical area, requires a wide-area two-way communication system. DA and DSM devices (customer meters, switches, etc.), embedded with powerline communication, can use the powerline as a communication medium, to construct a cost-effective and high speed transmission communication network. REMPLI project aims at designing and implementing a communication infrastructure for distributed data acquisition and remote control operation using the power grid as the communication medium. In this paper, we evaluate the REMPLI PLC network performance to show how the requirements for both DA/DSM applications can be met. And a scheduling policy is proposed to provide the applications with differentiate QoS in a multitasking environment
  • Keywords
    carrier transmission on power lines; data acquisition; demand side management; distribution networks; embedded systems; telecontrol; REMPLI PLC network performance evaluation; REMPLI project; demand side management system; distributed data acquisition; embedded powerline communication; high speed transmission communication network; large scale distribution automation; remote control operation; Automation; Communication networks; Communication switching; Communication system control; Data acquisition; Energy management; Large-scale systems; Power grids; Power system management; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronic and Embedded Systems and Applications, Proceedings of the 2nd IEEE/ASME International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    0-7803-9721-5
  • Type

    conf

  • DOI
    10.1109/MESA.2006.296955
  • Filename
    4077782