Title :
Space charge characteristics of epoxy-creped paper composites
Author :
Xin Ning ; Zhen Xiang ; Peng Liu ; Zongren Peng ; Shaoqing Chen
Author_Institution :
State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
fDate :
June 30 2013-July 4 2013
Abstract :
In order to study the interfacial effect on space charge distribution in HVDC bushings which impregnated with epoxy resin, samples just like epoxy-impregnated paper-epoxy were prepared by vacuum casting process. Space charge characteristics have been studied by the method of pulsed electroacoustic (PEA) technique at different electric fields and temperatures, including charge polarity, charge amount, the threshold for space charge accumulation. It was found that the polarity of the interfacial charge was related to electric field and temperature. When at 20kV/mm, 313K, there was heterocharge at the interface between epoxy and impregnated paper. But when temperature went up to 353K, homocharge accumulated at both interfaces. However, when at 10kV/mm, there was heterocharge whether the temperature was 313K or 353K. At the same time, threshold for charge accumulation reduced when temperature went up. Above phenomenons were thought to be the result of dielectric polarization and charge injection.
Keywords :
bushings; epoxy insulation; epoxy insulators; impregnated insulation; paper; pulsed electroacoustic methods; resins; space charge; vacuum casting; HVDC bushings; PEA technique; charge injection; dielectric polarization; electric field; electric fields; epoxy resin; epoxy-creped paper composites; epoxy-impregnated paper-epoxy; interfacial charge polarity; interfacial effect; pulsed electroacoustic technique; space charge accumulation; space charge characteristics; temperature 313 K to 353 K; vacuum casting process; Dielectrics; Electric fields; Electrodes; Epoxy resins; Insulation; Permittivity; Space charge; creped paper; epoxy resin; interfacial effect; space charge;
Conference_Titel :
Solid Dielectrics (ICSD), 2013 IEEE International Conference on
Conference_Location :
Bologna
Print_ISBN :
978-1-4799-0807-3
DOI :
10.1109/ICSD.2013.6619824