• DocumentCode
    3343312
  • Title

    Validation of kill-rate and yield model for clustering visual defects in semiconductor manufacturing

  • Author

    Yeh, Chi-Hao ; Chen, Cheng-Hsiung ; Wu, Ful-Chiang ; Lai, Rei-Lung ; Ouyang, Bin-Chung

  • Author_Institution
    Dept. of Ind. Eng. & Manage., Nat. Taipei Univ. of Technol.
  • fYear
    2005
  • fDate
    14-17 Dec. 2005
  • Firstpage
    762
  • Lastpage
    767
  • Abstract
    This paper validates the kill rate for different types of visual defects and resulting yield by using large amount of real inspection data in semiconductor manufacturing. Visual defects are assumed to be distributed in cluster. The results of this estimation model is slightly different from real inspection data. Therefore, this model is feasible to estimate the kill rate and the yield of mature product. However, since the corresponding manufacturing process for a new product may often result in multiple visual defects on a die. That can be verified by incorporating real inspection data of new product and this estimation model as well
  • Keywords
    automatic optical inspection; dies (machine tools); pattern clustering; semiconductor device manufacture; statistical analysis; clustering visual defects; inspection data; semiconductor manufacturing; shop floor information system; wafer fabrication; Electrical products industry; Engineering management; Industrial engineering; Inspection; Semiconductor device manufacture; Semiconductor device modeling; Technology management; Testing; Virtual manufacturing; Yield estimation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Technology, 2005. ICIT 2005. IEEE International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    0-7803-9484-4
  • Type

    conf

  • DOI
    10.1109/ICIT.2005.1600738
  • Filename
    1600738