DocumentCode
3343312
Title
Validation of kill-rate and yield model for clustering visual defects in semiconductor manufacturing
Author
Yeh, Chi-Hao ; Chen, Cheng-Hsiung ; Wu, Ful-Chiang ; Lai, Rei-Lung ; Ouyang, Bin-Chung
Author_Institution
Dept. of Ind. Eng. & Manage., Nat. Taipei Univ. of Technol.
fYear
2005
fDate
14-17 Dec. 2005
Firstpage
762
Lastpage
767
Abstract
This paper validates the kill rate for different types of visual defects and resulting yield by using large amount of real inspection data in semiconductor manufacturing. Visual defects are assumed to be distributed in cluster. The results of this estimation model is slightly different from real inspection data. Therefore, this model is feasible to estimate the kill rate and the yield of mature product. However, since the corresponding manufacturing process for a new product may often result in multiple visual defects on a die. That can be verified by incorporating real inspection data of new product and this estimation model as well
Keywords
automatic optical inspection; dies (machine tools); pattern clustering; semiconductor device manufacture; statistical analysis; clustering visual defects; inspection data; semiconductor manufacturing; shop floor information system; wafer fabrication; Electrical products industry; Engineering management; Industrial engineering; Inspection; Semiconductor device manufacture; Semiconductor device modeling; Technology management; Testing; Virtual manufacturing; Yield estimation;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Technology, 2005. ICIT 2005. IEEE International Conference on
Conference_Location
Hong Kong
Print_ISBN
0-7803-9484-4
Type
conf
DOI
10.1109/ICIT.2005.1600738
Filename
1600738
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