• DocumentCode
    3344058
  • Title

    Dielectric properties of CaCu3Ti4O12 ceramics fabricated with high purity nanometric powders

  • Author

    Hui Wang ; Chunjiang Lin ; Jinqiang He ; Shengtao Li

  • Author_Institution
    State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
  • fYear
    2013
  • fDate
    June 30 2013-July 4 2013
  • Firstpage
    1076
  • Lastpage
    1079
  • Abstract
    The characteristics of raw material powders, such as the purity and average particle size, have a major impact on the microstructure and properties of the CaCu3Ti4O12 ceramics. The properties of CaCu3Ti4O12 ceramics fabricated with nano-size powders (~30 nm) are compared with those of the samples with submicron powders (0.1~0.3 μm). It is found that, the samples fabricated with nano-size powders have homogenous microstructure and stable performance, and the dielectric constant is improved by an order of magnitude. It is considered that the relaxation peak with the energy level of 0.38 eV is dominated by impurity defect which mainly originates from raw materials, because this peak disappears in the samples with high purity raw material. This research provides a technical guidance for the application of this material.
  • Keywords
    calcium compounds; ceramics; crystal microstructure; dielectric relaxation; nanoparticles; particle size; permittivity; powders; CaCu3Ti4O12; average particle size; ceramic dielectric properties; ceramic microstructure; dielectric constant; energy level; high purity nanometric powders; high purity raw material; homogenous microstructure; impurity defect; material application; nanosize powders; raw material powder characteristics; relaxation peak; stable performance; submicron powders; Ceramics; Dielectrics; Energy states; Grain boundaries; Microstructure; Powders; Raw materials; CaCu3Ti4O12 ceramics; dielectric properties; nano-size powders; raw materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics (ICSD), 2013 IEEE International Conference on
  • Conference_Location
    Bologna
  • ISSN
    2159-1687
  • Print_ISBN
    978-1-4799-0807-3
  • Type

    conf

  • DOI
    10.1109/ICSD.2013.6619877
  • Filename
    6619877