DocumentCode :
3344787
Title :
A leak-proof plate-fin heat exchanger concept for process plant applications
Author :
McDonald, Colin F.
Author_Institution :
McDonald Thermal Eng., La Jolla, CA, USA
fYear :
1997
fDate :
27 Jul-1 Aug 1997
Firstpage :
1497
Abstract :
Over the last four decades, plate-fin heat exchangers have been used extensively for aerospace applications, their major attributes being compact size, lightweight overall assembly and high reliability. Several million units have seen service for a wide range of fluids, including operation at high temperature and pressure, and clearly a well established technology base exists. Within the process industries, the heat exchanger trend is towards units of smaller size and weight, and lower cost, and the utilization of the plate-fin type of construction is viewed as being in concert with these goals. Recognizing that there are applications involving dissimilar fluids, where an internal heat exchanger leak could result in a hazardous condition, a leak-proof concept to avoid this is discussed in this paper. For a plate-fin heat exchanger of brazed construction, this is achieved by means of a double headering bar system and a buffer layer between the two fluids. Online monitoring of heat exchanger integrity can be achieved by monitoring a small continuous purge flow in the buffer interspace. The process industry can benefit from a well established aircraft heat exchanger technology base that exists for this type of compact leak-proof heat exchanger
Keywords :
brazing; heat exchangers; reliability; brazed construction; buffer layer; double headering bar system; leak-proof plate-fin heat exchanger; online integrity monitoring; process plant applications; technology base; Aerospace industry; Chemical industry; Construction industry; Gas industry; Geometry; Heat engines; Heat transfer; Metals industry; Road safety; Water heating;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Engineering Conference, 1997. IECEC-97., Proceedings of the 32nd Intersociety
Conference_Location :
Honolulu, HI
Print_ISBN :
0-7803-4515-0
Type :
conf
DOI :
10.1109/IECEC.1997.661991
Filename :
661991
Link To Document :
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