The influence of heat sink on noise susceptibility of IC

Author

Nonaka, Junpei ; Nitta, Shuichi ; Mutoh, Atsuo ; Miyashita, Takuya

Author_Institution

Dept. of Mech. Syst. Eng., Tokyo Univ. of Agric. & Technol., Japan

Volume

1

fYear

1998

fDate

24-28 Aug 1998

Firstpage

231

Abstract

This study discusses the influence of a heat sink (in the case that a heat sink is a plain conductor) on noise susceptibility of an IC. Paying attention to the capacitive coupling between adjacent PCBs (printed circuit boards), the equivalent model of capacitive coupling in the case of the existence of a heat sink is proposed. The induced noise voltage on an IC lead is predicted by applying the finite element method to the prediction of the capacitance between a noise source and a heat sink, and the predicted results are compared with the measured results. It is concluded that prediction method is practically useful below the 100 MHz, as the predicted results coincide with measured results within 2 dB below 50 MHz and within 5 dB below 90 MHz

Keywords

capacitance; capacitors; electric noise measurement; electromagnetic interference; equivalent circuits; finite element analysis; heat sinks; integrated circuit measurement; voltage measurement; IC; IC lead; adjacent PCB; capacitance prediction; capacitive coupling; equivalent model; finite element method; heat sink; induced noise voltage; noise source; noise susceptibility; plain conductor; printed circuit boards; Capacitance; Conductors; Coupling circuits; Finite element methods; Heat sinks; Integrated circuit modeling; Integrated circuit noise; Lead; Printed circuits; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 1998. 1998 IEEE International Symposium on

Conference_Location

Denver, CO

Print_ISBN

0-7803-5015-4

Type

conf

DOI

10.1109/ISEMC.1998.750091

Filename

750091