DocumentCode
3345007
Title
Designing Next Generation Clusters: Evaluation of InfiniBand DDR/QDR on Intel Computing Platforms
Author
Subramoni, Hari ; Koop, Matthew ; Panda, Dhabaleswar K.
Author_Institution
Dept. of Comput. Sci. & Eng., Ohio State Univ., Columbus, OH, USA
fYear
2009
fDate
25-27 Aug. 2009
Firstpage
112
Lastpage
120
Abstract
Clusters based on commodity components continue to be very popular for high-performance computing (HPC). These clusters must be careful to balance both computational as well as I/O requirements of applications. This I/O requirement is generally fulfilled by a high-speed interconnect such as InfiniBand. The balance of computational and I/O performance is often changing, with the latest change being made by the Intel "Nehalem" architecture that can dramatically increase computing power. In this paper we explore how this balance has changed and how different speeds of InfiniBand interconnects including Double Data Rate (DDR) and Quad Data Rate(QDR) InfiniBand HCAs. We explore micro benchmarks, the "communication balance" ratio of intra-node to inter-node performance as well as end application performance. We show up to 10% improvement when using a QDR interconnect for Nehalem systems versus a DDR interconnection the NAS Parallel Benchmarks. We also see up to 25% performance gain with the HPCC randomly ordered ring bandwidth benchmark.
Keywords
multiprocessor interconnection networks; parallel architectures; performance evaluation; workstation clusters; Double Data Rate; HPCC randomly ordered ring bandwidth benchmark; I/O requirement; InfiniBand DDR/QDR; InfiniBand interconnects; Intel architecture; Intel computing platform; Nehalem; Quad Data Rate; high-performance computing; high-speed interconnect; next generation clusters; Application software; Bandwidth; Computer architecture; Computer science; Costs; Design engineering; High performance computing; Performance gain; Power system interconnection; US Department of Energy; InfiniBand; Nehalem; QDR;
fLanguage
English
Publisher
ieee
Conference_Titel
High Performance Interconnects, 2009. HOTI 2009. 17th IEEE Symposium on
Conference_Location
New York, NY
ISSN
1550-4794
Print_ISBN
978-0-7695-3847-1
Electronic_ISBN
1550-4794
Type
conf
DOI
10.1109/HOTI.2009.24
Filename
5238678
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