• DocumentCode
    3345057
  • Title

    Data Center Switch Architecture in the Age of Merchant Silicon

  • Author

    Farrington, Nathan ; Rubow, Erik ; Vahdat, Amin

  • Author_Institution
    Dept. of Comput. Sci. & Eng., UC San Diego, San Diego, CA, USA
  • fYear
    2009
  • fDate
    25-27 Aug. 2009
  • Firstpage
    93
  • Lastpage
    102
  • Abstract
    Today, data center networks that scale to tens of thousands of ports require the use of highly-specialized ASICs, with correspondingly high development costs. Simultaneously, these networks also face significant performance and management limitations. Just as commodity processors and disks now form the basis of computing and storage in the data center, we argue that there is an opportunity to leverage emerging high-speed commodity merchant switch silicon as the basis for a scalable, cost-effective, modular, and more manageable data center network fabric. This paper describes how to save cost and power by repackaging an entire data center network as a distributed multi-stage switch using a fat-tree topology and merchant silicon instead of proprietary ASICs. Compared to a fat tree of discrete packet switches, a 3,456-port 10 Gigabit Ethernet realization of our architecture costs 52% less, consumes 31% less power, occupies 84% less space, and reduces the number of long, cumbersome cables from 6,912 down to 96, relative to existing approaches.
  • Keywords
    computer centres; computer network management; local area networks; telecommunication network topology; telecommunication switching; Ethernet; commodity processors; data center network fabric management; data center switch architecture; disks; distributed multistage switch; fat-tree topology; high-speed commodity merchant switch silicon; Cables; Computer network management; Computer networks; Costs; Ethernet networks; Fabrics; Network topology; Packet switching; Silicon; Switches; asic; commodity; data center; ethernet; fat tree; network; switch;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Performance Interconnects, 2009. HOTI 2009. 17th IEEE Symposium on
  • Conference_Location
    New York, NY
  • ISSN
    1550-4794
  • Print_ISBN
    978-0-7695-3847-1
  • Electronic_ISBN
    1550-4794
  • Type

    conf

  • DOI
    10.1109/HOTI.2009.11
  • Filename
    5238680