DocumentCode
3345366
Title
Foreword
fYear
2005
fDate
May 31 2005-June 3 2005
Abstract
Presents the welcome message from the conference proceedings.
Keywords
Components, Packaging, and Manufacturing Technology Society; Components, packaging, and manufacturing technology; Educational technology; Electronic components; Electronics industry; Electronics packaging; Environmentally friendly manufacturing techniques; Manufacturing industries; Paper technology; Technological innovation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
0-7803-8907-7
Type
conf
DOI
10.1109/ECTC.2005.1441231
Filename
1441231
Link To Document