Title :
IXE 7000 Ethernet switch package development
Author :
Mathew, Ranjan ; Hasan, Altaf ; Yang, Liyu ; Chen, Chi-te ; Tran, Harvey ; Abhyankar, Raju
Author_Institution :
Intel Corp., Folsom, CA, USA
fDate :
31 May-3 June 2005
Abstract :
The IXE74242 is a device in the IXE 7000 product line targeted for high performance Layer 2/3/4 Ethernet communication switching with 24 × 1G b/s and 2 × 10 Gb/s ports. It is Intel Communication Group ESO division´s first 90 nm switch built in a 42.5 mm flip chip package. This paper describes the IXE74242 product and package development challenges in developing successful first working silicon on Intel´s 90 nm mixed signal silicon platform.
Keywords :
electronic switching systems; flip-chip devices; local area networks; mixed analogue-digital integrated circuits; product development; semiconductor device packaging; 42.5 mm; 90 nm; Ethernet communication switching; Ethernet switch package; IXE 7000; flip chip package; Communication switching; Ethernet networks; Flip chip; Network servers; Packaging; Routing; Signal design; Silicon; Stacking; Switches;
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Print_ISBN :
0-7803-8907-7
DOI :
10.1109/ECTC.2005.1441236
