Title :
Realization of Pb-Free FC-BGA Technology on Low-k Device
Author :
Hayashi, Eiji ; Baba, Shinji ; Idaka, Shiori ; Maeda, Akira ; Satoh, Mitsuru ; Kimura, Michitaka
fDate :
May 31 2005-June 3 2005
Keywords :
Aluminum; Assembly; Copper; Dielectric materials; Electronics packaging; Lead; Mechanical factors; Resins; Silver; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
0-7803-8907-7
DOI :
10.1109/ECTC.2005.1441237
