Title :
Development of 50mm Flipchip Plastic Ball Grid Array Package with Low-K Silicon Technology
Author :
Kutlu, Zafer ; Rajagopalan, Sarathy ; Chung, Chaowen
fDate :
May 31 2005-June 3 2005
Keywords :
Circuit testing; Copper; Delamination; Dielectric materials; Dielectric substrates; Electronics packaging; Materials reliability; Plastic packaging; Silicon; Stress;
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
0-7803-8907-7
DOI :
10.1109/ECTC.2005.1441238
