DocumentCode
3345499
Title
High I/O Glass Ceramic Package Pb-Free BGA Interconnect Reliability
Author
Dai, Xiang ; Pan, Ning ; Castro, Alicia ; Culler, Jason ; Hussain, Mumtaz ; Lewis, Russ ; Michalka, Tim
fYear
2005
fDate
May 31 2005-June 3 2005
Firstpage
23
Lastpage
29
Keywords
Application software; Assembly; Ceramics; Glass; High performance computing; Integrated circuit interconnections; Packaging; Soldering; Testing; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
0-7803-8907-7
Type
conf
DOI
10.1109/ECTC.2005.1441240
Filename
1441240
Link To Document