• DocumentCode
    3345540
  • Title

    Thermo-Mechanical Reliability of High-End Flip Chip BGA Packages: Comparison Heat Spreader and Motherboard Construction

  • Author

    Kim, Sang Ha ; Park, Han ; Suzuki, Katsunobu

  • fYear
    2005
  • fDate
    May 31 2005-June 3 2005
  • Firstpage
    38
  • Lastpage
    43
  • Keywords
    Electronic packaging thermal management; Failure analysis; Fatigue; Flip chip; Immune system; Resistance heating; Soldering; Testing; Thermal resistance; Thermomechanical processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441242
  • Filename
    1441242
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3345540