Title :
Effect of Intermetallics Spalling on the Mechanical Behavior of Electroless Ni(P)/Pb-Free Solder Interconnection
Author :
Sohn, Yoon-Chul ; Yu, Jin ; Kang, Sung K. ; Shih, Da-Yuan ; Lee, Taek-Yeong
fDate :
May 31 2005-June 3 2005
Keywords :
Gold; Integrated circuit interconnections; Intermetallic; Metallization; Printed circuits; Soldering; Surface cracks; Surface finishing; Testing; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
0-7803-8907-7
DOI :
10.1109/ECTC.2005.1441250
