DocumentCode
3345749
Title
Impact of Cu Content on the Sn-Ag-Cu Interconnects
Author
Lu, Henry Y. ; Balkan, Haluk ; Vrtis, Joan ; Ng, K. Y Simon
fYear
2005
fDate
May 31 2005-June 3 2005
Firstpage
113
Lastpage
119
Keywords
Assembly systems; Chip scale packaging; Copper alloys; Electronic equipment testing; Electronic packaging thermal management; Environmentally friendly manufacturing techniques; Lead; Microstructure; Thermal stresses; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
0-7803-8907-7
Type
conf
DOI
10.1109/ECTC.2005.1441255
Filename
1441255
Link To Document