DocumentCode :
3345749
Title :
Impact of Cu Content on the Sn-Ag-Cu Interconnects
Author :
Lu, Henry Y. ; Balkan, Haluk ; Vrtis, Joan ; Ng, K. Y Simon
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
113
Lastpage :
119
Keywords :
Assembly systems; Chip scale packaging; Copper alloys; Electronic equipment testing; Electronic packaging thermal management; Environmentally friendly manufacturing techniques; Lead; Microstructure; Thermal stresses; Vehicles;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441255
Filename :
1441255
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3345749
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