Title :
Methods of underfill flow voids detection and minimization in flip chip package
Author :
Wang, Jinlin ; Hsu, Marcus ; Dunaway, Patrick ; He, Dongming ; Buckmann, Ken
Author_Institution :
Intel Corp., Chandler, AZ, USA
fDate :
31 May-3 June 2005
Abstract :
Rheological properties of underfills were measured at dispensing temperatures. The surface energy of different substrates and wetting angles of underfills on the substrates were also measured and showed differences between different substrates. It was observed that the viscosity of an underfill and substrate wetting have a strong impact on the formation of flow voids. A video underfill flow metrology was developed for flow void observation. The correlation between underfill, substrate properties, and flow voids formation based on. the video flow metrology measurement will be discussed. We will also discuss how to optimize the underfill and substrate properties to minimize the flow voids.
Keywords :
chip-on-board packaging; flip-chip devices; minimisation; rheology; signal processing; soldering; substrates; viscosity; voids (solid); wetting; flip chip package; flow voids formation; rheological properties; substrate properties; substrate wetting; surface energy; underfill flow metrology; underfill flow voids detection; underfill viscosity of; video flow metrology measurement; voids minimization; Energy measurement; Flip chip; Fluid flow measurement; Metrology; Minimization methods; Packaging; Rheology; Semiconductor device measurement; Temperature measurement; Viscosity;
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Print_ISBN :
0-7803-8907-7
DOI :
10.1109/ECTC.2005.1441266
