• DocumentCode
    3346013
  • Title

    Nano-Underfills for High-Reliability Applications in Extreme Environments

  • Author

    Lall, Pradeep ; Islam, Saiful ; Suhling, Jeff ; Tian, Guoyun

  • fYear
    2005
  • fDate
    May 31 2005-June 3 2005
  • Firstpage
    212
  • Lastpage
    222
  • Keywords
    Chip scale packaging; Electronic packaging thermal management; Integrated circuit interconnections; Mechanical engineering; Predictive models; Silicon compounds; Temperature dependence; Temperature distribution; Thermal expansion; Thermomechanical processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441269
  • Filename
    1441269
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3346013