• DocumentCode
    3346220
  • Title

    Signal Integrity and Power Integrity Properties of FCBGA Based on Ultra-Thin, High-Density Packaging Substrate

  • Author

    Sakai, Jun ; Shimoto, Tadanori ; Nakase, Koichiro ; Inoue, Hirobumi ; Motonaga, Kazuhiro ; Honda, Hirokazu

  • fYear
    2005
  • fDate
    May 31 2005-June 3 2005
  • Firstpage
    284
  • Lastpage
    290
  • Keywords
    Application specific integrated circuits; Dielectric substrates; Electronics packaging; Fabrication; Flowcharts; Frequency; Laminates; Large scale integration; National electric code; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441280
  • Filename
    1441280
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3346220