Development of a small die-small form factor flip chip package for application in LAN products

Author

Hasan, Altaf ; Robertson, Glenn ; Mensah, Kofi ; Molina, Al

fYear

2005

fDate

May 31 2005-June 3 2005

Firstpage

307

Lastpage

313

Keywords

Assembly; Bonding; CMOS technology; Ethernet networks; Flip chip; Lead; Local area networks; Packaging; Signal processing; Space technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

0-7803-8907-7

Type

DOI

10.1109/ECTC.2005.1441283

Filename

1441283

Link To Document