DocumentCode :
3346309
Title :
Wafer-Level Packaging of MEMS Accelerometers with Through-Wafer Interconnects
Author :
Yun, C.H. ; Brosnihan, T.J. ; Webster, W.A. ; Villarreal, J.
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
320
Lastpage :
323
Keywords :
Accelerometers; Electronics packaging; Etching; Fabrication; Integrated circuit interconnections; Micromechanical devices; Oxidation; Resists; Wafer bonding; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441285
Filename :
1441285
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3346309
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