DocumentCode
3346647
Title
Comparison of a Cu UBM versus a Co UBM for Sn Flip-Chip Bumps
Author
Labie, Riet ; Ratchev, Petar ; Beyne, Eric
fYear
2005
fDate
May 31 2005-June 3 2005
Firstpage
449
Lastpage
451
Keywords
Electrical resistance measurement; Electrons; Failure analysis; Fatigue; Flip chip; Intermetallic; Semiconductor device measurement; Testing; Thermal stresses; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
0-7803-8907-7
Type
conf
DOI
10.1109/ECTC.2005.1441303
Filename
1441303
Link To Document