DocumentCode :
3346778
Title :
Parametric Investigation of Dynamic Behavior of FBGA Solder Joints in Board-Level Drop Simulation
Author :
Groothuis, Steve ; Chen, Changming ; Kovacevic, Radovan
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
499
Lastpage :
503
Keywords :
Chip scale packaging; Circuit testing; Design optimization; Electric shock; Electronics packaging; Life estimation; Soldering; Solid modeling; Strain measurement; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441311
Filename :
1441311
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3346778
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