DocumentCode
3346810
Title
Embedded RF Balun for 3D System-in-Package Solutions
Author
Mäntysalo, Matti ; Ristolainen, Eero O.
fYear
2005
fDate
May 31 2005-June 3 2005
Firstpage
513
Lastpage
517
Keywords
Consumer electronics; Electromagnetic coupling; Electromagnetic measurements; Electronics packaging; Impedance matching; Integrated circuit interconnections; Manufacturing; Radio frequency; Semiconductor device packaging; Wireless communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
0-7803-8907-7
Type
conf
DOI
10.1109/ECTC.2005.1441313
Filename
1441313
Link To Document