DocumentCode :
3346867
Title :
Chip-Package-Board Codesign of Highly Linear 3G-CDMA Upconverter Modules
Author :
Han, F.Y. ; Wu, J.M. ; Horng, T.S. ; Tu, C.C. ; Chen, R. ; Chu, C.H.
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
528
Lastpage :
531
Keywords :
Electronic design automation and methodology; Foundries; Heterojunction bipolar transistors; Indium gallium arsenide; Integrated circuit interconnections; Linearity; MMICs; Multiaccess communication; Packaging; Radio frequency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441316
Filename :
1441316
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3346867
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