DocumentCode :
3347016
Title :
Laser Closing of Window as a Novel Wafer-Level Hermetic Packaging Technology
Author :
Cheung, K.P. ; Wang, Y. ; Pai, C.S.
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
566
Lastpage :
571
Keywords :
CMOS technology; Chemical technology; Costs; Encapsulation; Microelectromechanical devices; Micromechanical devices; Packaging; Protection; Temperature; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441324
Filename :
1441324
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3347016
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