DocumentCode :
3347202
Title :
Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages
Author :
Chong, Desmond Y R ; Ng, Kellin ; Tan, Jane Y N ; Low, Patrick T H ; Pang, John H L ; Che, F.X. ; Xiong, B.S. ; Xu, Luhua
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
622
Lastpage :
629
Keywords :
Assembly; Circuit testing; Electronics packaging; Environmentally friendly manufacturing techniques; Integrated circuit packaging; Integrated circuit testing; Intermetallic; Lead; Soldering; Surface finishing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441334
Filename :
1441334
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3347202
