DocumentCode

3347328

Title

Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints

Author

Lehman, L.P. ; Kinyanjui, R.K. ; Wang, J. ; Xing, Y. ; Zavalij, L. ; Borgesen, P. ; Cotts, E.J.

fYear

2005

fDate

May 31 2005-June 3 2005

Firstpage

674

Lastpage

681

Keywords

Assembly; Degradation; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Life estimation; Microstructure; Soldering; Switches; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

0-7803-8907-7

Type

conf

DOI

10.1109/ECTC.2005.1441341

Filename

1441341