DocumentCode :
3347335
Title :
Intermetallic Growth and Failure Study for Sn-Ag-Cu/ENIG PBGA Solder Joints Subject to Thermal Cycling
Author :
Xu, Luhua ; Pang, John H L ; Che, F.X.
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
682
Lastpage :
686
Keywords :
Aging; Electric shock; Environmentally friendly manufacturing techniques; Gold; Intermetallic; Isothermal processes; Lead; Nickel; Soldering; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441342
Filename :
1441342
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3347335
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